Новое поколение серверов Supermicro X11

Решения Supermicro X11 имеют множество преимуществ по сравнению с предыдущими поколениями: высокий уровень производительности, эффективности, безопасности и масштабируемости в любой отрасли.
Поколение Supermicro X11 поддерживает новейшие процессоры Intel® Xeon® Scalable, установку до 3TB ECC 3DS LRDIMM или RDIMM DDR4-2666MHz оперативной памяти в 24 слотах DIMM. Также есть поддержка до 7 устройств PCI-E, SAS 3.0 / SATA 3.0 / NVMe с поддержкой горячей замены HDD / SSD, сетевые интерфейсы 10GBase -T / 10G SFP + / 56 Гбит FDR InfiniBand. Избыточность блоков питания уровня Titanium (96% +) и IPMI 2.0 +KVM с выделенной локальной сетью. Системы SuperWorkstation предлагают дополнительно 7.1 HD Audio, SLI и поддержку Thunderbolt, до 11 портов USB.
Решения Supermicro X11 представлены в самых разнообразных форм-факторах: 1U, 2U, 3U / Mini-Tower, 4U / Tower и 8U SuperBlade®.
Платформы последнего поколения позволяют Supermicro предлагать самые обширные и технологически продвинутые решения вычислительных систем для ЦОД, предприятий, облачных вычислений, HPC, Hadoop / Big Data, Storage и Embedded.
Платформы обеспечивают максимальную производительность с высочайшим уровнем эффективности и надежности.

Серверные платформы новейшего поколения X11

BigTwin™ 6 NVMe per Node

SYS-2029BT-HNR

• 4 DP nodes in 2U; depth 28.5″, Each Node
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MH
• 6 Hot-swap 2.5″ NVMe drive bays per node
• 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card suppor
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 heavy duty 80mm fans w/ optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

BigTwin™ 4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node

SYS-2029BT-HNC0R

• 4 DP nodes in 2U; depth 28.5″, Each Node:
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5″ drive bays per node
• SAS3 support via Broadcom 3008; IT mode
• 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 heavy duty 80mm fans w/ optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

BigTwin™ 6 SATA3 per Node

SYS-2029BT-HTR

• 4 DP nodes in 2U; depth 28.5″, Each Node:
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 6 Hot-swap 2.5″ SATA3 drive bays per node
• 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 heavy duty 80mm fans w/ optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

BigTwin™ 12 NVMe per Node

SYS-2029BT-DNR

• 2 DP nodes in 2U; depth 28.5″, Each Node:
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 12 Hot-swap 2.5″ NVMe drive bays per node
• 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 heavy duty 80mm fans w/ optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

BigTwin™ 4 NVMe/SAS3 + 8 SAS3 per Node

SYS-2029BT-DNC0R

• 2 DP nodes in 2U; depth 28.5″, Each Node:
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5″ drive bays per node
• SAS3 (12Gbps) support via Broadcom 3216; IT mode
• 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 heavy duty 80mm fans w/ optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

TwinPro2

SYS-2029TP-HTR / SYS-2029TP-HC0R / SYS-2029TP-HC1R SYS-6029TP-HTR / SYS-6029TP-HC0R / SYS-6029TP-HC1R

• 4 DP nodes in 2U; depth 28.5″ (2029TP) / 30.5″ (6029TP), Each Node:
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• Storage Drive Options:
SYS-2029TP-HTR — 6 Hot-swap 2.5″ SATA3
SYS-2029TP-HC0R — 6 Hot-swap 2.5″ SAS3 (Broadcom 3008)
SYS-2029TP-HC1R — 6 Hot-swap 2.5″ SAS3 (Broadcom 3108)
SYS-6029TP-HTR — 3 Hot-swap 3.5″ SATA3
SYS-6029TP-HC0R — 3 Hot-swap 3.5″ SAS3 (Broadcom 3008)
SYS-6029TP-HC1R — 3 Hot-swap 3.5″ SAS3 (Broadcom 3108)
• 2 PCI-E 3.0 x16 Low-profile slots
• 1 SIOM card support for flexible networking options
• 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
• 4 Heavy duty 8cm fans with optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

8x 2.5″ + 8x 2.5″ SAS3 via Broadcom 3108 SATA3 via C620

SYS-2029P-C1RT / SYS-2029P-C1R

• Compute Intensive Application/Storage, Big Data Analytics, DB Application/Processing, Mission-critical Application, Simulation and Automation
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5″ SAS3 drives (via Broadcom 3108), 8 Hot-swap 2.5″ SATA3 drives (via Intel C620 series chipset)
• 4 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
• 2x 10GBase-T (-C1RT) / 1GbE (-C1R), 1 Dedicated IPMI port
• 1 Video, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
• 3 Hot-swap 80mm PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

Mainstream Cost Effective

SYS-6029P-TRT / SYS-6029P-TR

• Cloud, Virtualization, Compute Intensive App, DB Processing/Storage, High Availability Storage, Hosting & Application Delivery
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ SATA3 drive bays, 2 opt. fixed 2.5″ SATA, SSD/NVMe
• 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 Low-profile slots
• 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
• 3 heavy duty 80mm fans with PWM fan speed control
• 1000W Redundant Titanium Level (96%) Power Supplies

8 Hot-swap 3.5″ Bays 3 Peripheral 5.25″ bays Cost Effective

SYS-7049P-TRT / SYS-7049P-TR

• 4U Mainstream Server for Virtualization and Multi-Tasking
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ SATA3 drive bays, 3 Peripheral 5.25″ bays, 2 opt. fixed 2.5″ SATA, SSD/NVMe
• 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 slots
• 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
• 3 Hot-swap PWM cooling fans and 2 Hot-swap rear fans
• 1280W Redundant Platinum Level Power Supplies

Mainstream, UP

SYS-5019P-MT

• Web Hosting, VM, Application and Data Serving, DB Applications
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ SATA3 drive bays, M.2 mini-PCI-e support
• 1 PCI-E 3.0 x16 slot
• 2x 10GBase-T ports, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
• 4x 40mm mid-fan
• 350W Platinum Level Power Supply

Mainstream, UP

SYS-5019P-MTR

• Web Hosting, VM, Application and Data Serving, DB Applications, Mission-critical Applications
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ SATA3 drive bays, M.2 mini-PCI-e support
• 1 PCI-E 3.0 x16 slot
• 2x 10GBase-T ports, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
• 4x 40mm mid-fan
• 400W Redundant Platinum Level Power Supplies

Short Depth (19.98″) Data Center Optimized

SYS-1029P-MT

• 1U Data Center Optimized Server, Short-Depth
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5″ SATA3 drive bays
• 1 PCI-E 3.0 x16 (FHHL) slot
• 2 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
• 4x 4cm 22.5K RPM middle cooling fans
• 600W Platinum Level Power Supply

SYS-1029P-MTR

• 1U Data Center Optimized Server, Short-Depth
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5″ SATA3 drive bays
• 1 PCI-E 3.0 x8 (FHHL) slot
• 2 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
• 4x 4cm 22.5K RPM middle cooling fans
• 600W Redundant Platinum Level Power Supplies

Short Depth (19.98″) Data Center Optimized

SYS-6019P-MT

• 1U Data Center Optimized Server, Short-Depth
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ SATA3 drive bays
• 1 PCI-E 3.0 x8 (FHHL) slot
• 2 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
• 4x 4cm 22.5K RPM middle cooling fans
• 500W Platinum Level Power Supply

Short Depth (19.98″) Data Center Optimized

SYS-6019P-MTR

• 1U Data Center Optimized Server, Short-Depth
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ SATA3 drive bays
• 1 PCI-E 3.0 x8 (FHHL) slot
• 2 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
• 4x 4cm 22.5K RPM middle cooling fans
• 600W Redundant Platinum Level Power Supplies

20 NVMe support 24 DDR4 DIMM 2x 25G SFP28

SYS-1029UZ-TN20R25M

• Virtualization, Cloud Computing, High End Enterprise Server, SDS
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 20 Hot-swap 2.5″ 7mm drive bays; up to 20 NVMe (CPU1: 8 NVMe + 2 NVMe/SAS/SATA3 hybrid, CPU2: 10 NVMe)
• Up to 2 PCI-E 3.0 x8 (FH, FL)
• 2x 25G SFP28 Ethernet ports, 1 Dedicated IPMI port
• 1 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A), 2 USB 2.0 (front)
• 8 heavy duty fans w/ optimal fan speed control, 2 air shroud
• 1600W Redundant Titanium Level (96%) Power Supplies

10 NVMe support 24 DDR4 DIMM 2x 10GBase-T

SYS-1029U-TN10RT

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 10 Hot-swap 2.5″ drive bays; 10 NVMe (4 hybrid ports — optional SAS3 via AOC); 2 internal M.2 (1 SATA3, 1 NVMe)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L)
• 2x 10GBase-T ports, 1 Dedicated IPMI port
• 2 VGA (1 rear, 1 onboard), 1 Serial, 5 USB 3.0
• 8 heavy duty fans w/ optimal fan speed control
• 1000W Redundant Titanium Level (96%) Power Supplies

10x 2.5″ SATA3 or Opt. 8x SAS3 + 2x NVMe/SATA Flexible Network Opt.

SYS-1029U-TR4T / SYS-1029U-TR4 / SYS-1029U-TRT / SYS-1029U-TRTP / SYS-1029U-TRTP2 / SYS-1029U-TR25M

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 10 Hot-swap 2.5″ drive bays; 10 SATA3 (2 hybrid ports — 2 NVMe opt.)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) — SYS-1029U-TR25M
• Networking Options:
SYS-1029U-TR4 — 4x 1GbE ports
SYS-1029U-TR4T — 4x 10GBase-T ports
SYS-1029U-TRT — 2x 10GBase-T ports
SYS-1029U-TRTP — 2x 10G SFP+ ports
SYS-1029U-TRTP2 — 2x 10G SFP+ ports + 2x 1GbE ports
SYS-1029U-TR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 5 USB 3.0 (2 rear, 2 front, 1 Type A)
• 8 heavy duty fans w/ optimal fan speed control
• 750W Redundant Platinum Level Power Supplies

10x 2.5″ SAS3 Flexible Network Opt.

SYS-1029U-E1CR4T / SYS-1029U-E1CR4 / SYS-1029U-E1CRT / SYS-1029U-E1CRTP / SYS-1029U-E1CRTP2 / SYS-1029U-E1CR25M

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 10 Hot-swap 2.5″ drive bays; 10 SAS3 via optional AOC
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) — SYS-1029U-E1CR25M
• Networking Options:
SYS-1029U-E1CR4 — 4x 1GbE ports
SYS-1029U-E1CR4T — 4x 10GBase-T ports
SYS-1029U-E1CRT — 2x 10GBase-T ports SYS-1029U-E1CRTP — 2x 10G SFP+ ports
SYS-1029U-E1CRTP2 — 2x 10G SFP+ ports + 2x 1GbE ports
SYS-1029U-E1CR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 COM/Serial
• 5 USB 3.0 (2 rear, 2 front, 1 Type A)
• 8 heavy duty fans w/ optimal fan speed control
• 750W Redundant Platinum Level Power Supplies

4 NVMe support 24 DDR4 DIMM 4x/2x 10GBase-T

SYS-6019U-TN4R4T / SYS-6019U-TN4RT

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays; 4 NVMe/SAS3 hybrid ports, 2 internal M.2 (1 SATA3, 1 NVMe)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
• Networking Options:
SYS-6019U-TN4R4T — 4x 10GBase-T ports
SYS-6019U-TN4RT — 2x 10GBase-T ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 3 USB 3.0 (2 rear, 1 Type A)
• 8 heavy duty fans w/ optimal fan speed control
• 750W Redundant Platinum Level Power Supplies

4x 3.5″ SATA3 Flexible Network Opt.

SYS-6019U-TR4T / SYS-6019U-TR4 / SYS-6019U-TRT / SYS-6019U-TRTP / SYS-6019U-TRTP2 / SYS-6019U-TR25M

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) — SYS-6019U-TR25M
• Networking Options:
SYS-6019U-TR4 — 4x 1GbE ports
SYS-6019U-TR4T — 4x 10GBase-T ports
SYS-6019U-TRT — 2x 10GBase-T ports
SYS-6019U-TRTP — 2x 10G SFP+ ports
SYS-6019U-TRTP2 — 2x 10G SFP+ ports + 2x 1GbE ports
SYS-6019U-TR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 3 USB 3.0 (2 rear, 1 Type A)
• 8 heavy duty fans w/ optimal fan speed control
• 750W Redundant Platinum Level Power Supplies

24 NVMe support 4x 10GBase-T

SYS-2029U-TN24R4T

• Virtualization Hosting, Cloud Computing, Data Center
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 24 Hot-swap 2.5″ drive bays; 24 NVMe (4 hybrid ports — SAS3 via AOC), 2 rear Hot-swap 2.5″ drive bays; 2 internal M.2 (1 SATA3, 1 NVMe)
• 2 PCI-E 3.0 x16 (FH, 10.5″ L), 1 PCI-E 3.0 x8 (LP)
• 4 10GBase-T ports, 1 Dedicated IPMI port
• 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
• 4 heavy duty 8cm PWM fans
• 1600W Redundant Titanium Level (96%) Power Supplies

24x 2.5″ Drive Bays Opt. 20 SAS3 + 4 NVMe/SAS3 Flexible Network Opt.

SYS-2029U-TR4T / SYS-2029U-TR4 / SYS-2029U-TRT / SYS-2029U-TRTP / SYS-2029U-TR25M

• Virtualization Hosting, Cloud Computing, Data Center
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 24 Hot-swap 2.5″ drive bays; 14 SATA (opt. 20 SAS3 + 4 NVMe/SAS3)
• 1 PCI-E 3.0 x16 and 5 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP)
• 2 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP, LP internal) — SYS-2029U-TR4T
• Networking Options:
SYS-2029U-TR4 — 4x 1GbE ports
SYS-2029U-TR4T — 4x 10GBase-T ports
SYS-2029U-TRT — 2x 10GBase-T ports
SYS-2029U-TRTP — 2x 10G SFP+ ports
SYS-2029U-TR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 3 USB 3.0 (2 rear, 1 Type A)
• 4 heavy duty 8cm PWM fans
• 1000W Redundant Titanium Level (96%) Power Supplies

24x 2.5″ SAS3 Opt. 4 NVMe Flexible Network Opt.

SYS-2029U-E1CR4T / SYS-2029U-E1CR4 / SYS-2029U-E1CRT SYS-2029U-E1CRTP / SYS-2029U-E1CR25M

• Virtualization Hosting, Cloud Computing, Data Center

• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 24 Hot-swap 2.5″ drive bays; 24 SAS3 via optional AOC (4 hybrid ports — 4 NVMe Opt.)
• 1 PCI-E 3.0 x16 and 5 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP)
• 2 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP, LP internal) — SYS-2029U-E1CR4T
• Networking Options:
SYS-2029U-E1CR4 — 4x 1GbE ports
SYS-2029U-E1CR4T — 4x 10GBase-T ports
SYS-2029U-E1CRT — 2x 10GBase-T ports
SYS-2029U-E1CRTP — 2x 10G SFP+ ports
SYS-2029U-E1CR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port
• 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
• 4 heavy duty 8cm PWM fans
• 1000W Redundant Titanium Level (96%) Power Supplies

12x 3.5″ SATA3 Opt. 4 NVMe Flexible Network Opt.

SYS-6029U-TR4T / SYS-6029U-TR4 / SYS-6029U-TRT / SYS-6029U-TRTP / SYS-6029U-TR25M

• Virtualization, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 12 Hot-swap 3.5″ drive bays; 12 SATA (optional 8 SAS3 + 4 NVMe/SAS3)
• 1 PCI-E 3.0 x16 and 5 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP)
• 2 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP, LP internal) — SYS-6029U-TR4T
• Networking Options:
SYS-6029U-TR4 — 4x 1GbE ports
SYS-6029U-TR4T — 4x 10GBase-T ports
SYS-6029U-TRT — 2x 10GBase-T ports
SYS-6029U-TRTP — 2x 10G SFP+ ports
SYS-6029U-TR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 3 USB 3.0 (2 rear, 1 Type A)
• 4 heavy duty fans w/ optimal fan speed control
• 1000W Redundant Titanium Level (96%) Power Supplies

12x 3.5″ SAS3 opt. 4 NVMe Flexible Network Opt.

SYS-6029U-E1CR4T / SYS-6029U-E1CR4 / SYS-6029U-E1CRT / SYS-6029U-E1CRTP / SYS-6029U-E1CR25M

• Virtualization, Hyper converge Storage, Cloud Computing, High End Enterprise Server
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz
• 12 Hot-swap 3.5″ drive bays; 12 SAS3 via opt. AOC (4 hybrid ports — 4 NVMe opt.)
• 1 PCI-E 3.0 x16 and 5 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP)
• 2 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 (FH, 10.5″L), 2 PCI-E 3.0 x8 (LP, LP internal) — SYS-6029U-E1CR4T
• Networking Options:
SYS-6029U-E1CR4 — 4x 1GbE ports
SYS-6029U-E1CR4T — 4x 10GBase-T ports
SYS-6029U-E1CRT — 2x 10GBase-T ports
SYS-6029U-E1CRTP — 2x 10G SFP+ ports
SYS-6029U-E1CR25M — 2x 25GbE SFP28 ports
• 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
• 3 USB 3.0 (2 rear, 1 Type A)
• 4 heavy duty 8cm PWM fans
• 1000W Redundant Titanium Level (96%) Power Supplies

WIO, Flexible I/O 10 Hot-swap 2.5″ bays Opt. 2 NVMe support

SYS-1029P-WTRT

• Cloud and other virtualization needs, hosting & application delivery, database processing & storage, simulation, automation
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 10 Hot-swap 2.5″ drive bays; 8 SATA3 + 2 NVMe/SATA3 hybrid ports
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
• 2x 10GBase-T ports via Intel X722, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 front via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies

SYS-1029P-WTR

• Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5″ drive bays; 1 slim DVD-ROM bay (option)
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
• 2x 1GbE ports via Intel X722, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies

SYS-1029P-WT

• Web Server, Firewall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5″ drive bays; 1 slim DVD-ROM bay (option)
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
• 2x 1GbE ports via Intel X722, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply

WIO, Flexible I/O 4 Hot-swap 3.5″ bays

SYS-6019P-WTR

• Web Server, Firewall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
• 2x 1GbE ports via Intel X722, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies

WIO, Flexible I/O 4 Hot-swap 3.5″ bays

SYS-6019P-WT

• Web Server, Firewall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
• 2x 1GbE ports via Intel X722, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 4 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply

WIO, Flexible I/O, UP 10 Hot-swap 2.5″ bays

SYS-1019P-WTR

• Database Processing and Storage, Data Center Applications
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 10 Hot-swap 2.5″ drive bays, M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies

WIO, Flexible I/O, UP 4 Hot-swap 3.5″ bays

SYS-5019P-WT

• Database Processing and Storage, Data Center / Firewall Applications
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays, 1 slim DVD-ROM bay, M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply

WIO, Flexible I/O, UP 4 Hot-swap 3.5″ bays

SYS-5019P-WTR

• Database Processing and Storage, Data Center / Firewall Applications
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5″ drive bays, M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies

WIO, Flexible I/O, UP 8 Hot-swap 3.5″ bays

SYS-5029P-WTR

• Database Processing and Storage, Connectivity/Storage Computer Nodes, Data Warehouse
• Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ drive bays, 1 Slim DVD-ROM bay, M.2 mini-PCI-e support
• 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 3 Hot-swap 8cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies

WIO, Flexible I/O 12 Hot-swap 3.5″ bays

SYS-6029P-WTRT

• Web Server, Firewall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 12 Hot-swap 3.5″ drive bays with SES2 and Mini-i-Pass
• 1 PCI-E 3.0 x16 (FHHL), 2 PCI-E 3.0 x8 (FHHL), 1 PCI-E 3.0 x8 (LP)
• 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 4 USB 3.0 (rear)
• 3 high-performance 8cm PWM fans
• 1200W Redundant Titanium Level (96%) Power Supplies

WIO, Flexible I/O 8 Hot-swap 3.5″ and 2 Fixed 3.5″ bays

SYS-6029P-WTR

• Web Server, Firewall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ drive bays with SGPIO, 2 Fixed 3.5″ drive bays
• 4 PCI-E 3.0 x8 (2 FHFL, 2 FHHL), 2 PCI-E 3.0 x8 ((LP)
• 2x GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 3 high-performance 8cm heavy duty PWM fans
• 1000W Redundant Titanium Level (96%) Power Supplies

11 PCI-E Slots 16 Hot-swap 2.5″, 1 Peripheral 5.25

SYS-2029P-TXRT

• 2U Max I/O Server — Expansion / Performance / Flexibility
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 11.2GT/s
• 16 Hot-swap 2.5″ drive bays and 1 peripheral 5.25″ bay
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot) • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
• 2 GbE, 1 Video, 2 COM, 2 USB 3.0 (rear), 4 USB 2.0 (rear), 1 Type A
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 4x 80mm 7K RPM middle fans
• 1000W Redundant Titanium Level (96%) Power Supplies

11 PCI-E Slots 8 Hot-swap 3.5″, 2 Peripheral 5.25″

SYS-6039P-TXRT

• 3U Max I/O Server — Expansion / Performance / Flexibility
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 11.2GT/s
• 8 Hot-swap 3.5″ SATA3 drive bays and 2 Peripheral 5.25″ bays
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
• 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
• 2 GbE, 1 Video, 2 COM, 4 USB 3.0 (2 rear, 2 via header), 4 USB 2.0 (2 rear, 2 via header), 1 Type A
• System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
• 3x 80mm middle fans and 1x 80mm fear exhaust fan
• 980W Redundant Platinum Level Power Supplies

Rear I/O, 8-Node, Each: 6 Hot-swap 2.5″ SAS3/SATA3/NVMe opt.

SYS-F619P2-RT / F619P2-RTN / F619P2-RC0 / F619P2-RC1

• FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• Storage Options (all Hot-swap):
F619P2-RT — 6 2.5″ SATA3
F619P2-RTN — 6 2.5″ SATA3 or 2 SATA3 + 4 NVMe U.2
F619P2-RC0 — 6 2.5″ SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
F619P2-RC1 — 6 2.5″ SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
• 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
• SIOM flexible Network card, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0, 1 M.2 support
• 3x 4cm 20k RPM middle fans
• 2200W Redundant Titanium Level (96%) Power Supplies

Rear I/O, 4-Node, Each: 6 Hot-swap 2.5″ SAS3/SATA3/NVMe opt.

SYS-F629P3-RTB / F629P3-RTBN / F629P3-RC0B / F629P3-RC1B

• FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• Storage Options (all Hot-swap):
F629P3-RTB — 8 3.5″ SATA3
F629P3-RTBN — 8 3.5″ SATA3 or 6 SATA3 + 2 NVMe U.2
F629P3-RC0B — 8 3.5″ SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
F629P3-RC1B — 8 3.5″ SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
• 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
• SIOM flexible Network card, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0, 1 M.2 support
• 2x 8cm 14k RPM middle fans
• 1200W Redundant Titanium Level (96%) Power Supplies

 Up to 2 GPUs in 1U

 SYS-1019GP-TT

• HPC cluster computer nodes
• Single Socket P (LGA 3647) supports: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 6 Hot-swap 2.5″ SAS/SATA drive bays
• 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear)
• 8 heavy duty 4cm counter-rotating fans with air shroud
• 1400W Platinum Level (94%) Power Supplies

Up to 2 GPUs in 1U

SYS-5019GP-TT

• HPC cluster computer nodes
• Single Socket P (LGA 3647) supports: Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 Hot-swap 3.5″ SAS/SATA drive bays
• 1 slim DVD-ROM bay or 1 USB + COM port tray
• 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear)
• 8 heavy duty 4cm counter-rotating fans with air shroud
• 1400W Platinum Level (94%) Power Supplies

Up to 4 Nvidia Tesla P100 SXM2 GPUs

SYS-1029GQ-TXRT

• HPC, Artificial Intelligence, Big Data Analytics, Research Lab, Astrophysics, Business Intelligence
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 2 Hot-swap 2.5″ SAS/SATA/NVMe drive bays, 2 Internal 2.5″ drive bays
• 4 PCI-E 3.0 x16 and 1 PCI-E x8 (LP) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
• 9x 4cm heavy duty counter-rotating fans with air shroud
• 2000W Redundant Titanium Level (96%) Power Supplies

Up to 4 GPUs in 1U

SYS-1029GQ-TRT

• GPU Server, Mission-critical app., enterprise server, oil & gas, financial, 3D rendering, chemistry, HPC
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 2 Hot-swap 2.5″ SAS/SATA/NVMe drive bays, 2 Internal 2.5″ drive bays
• 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E x16 (LP), and 1 PCI-E 3.0 x8 (LP) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
• 9x 4cm heavy duty counter-rotating fans with air shroud
• 2000W Redundant Titanium Level (96%) Power Supplies

Up to 4 GPUs in 1U

SYS-1029GQ-TNRT

• High-performance Computing, Big Data Analytics, Business Intelligence, Research Lab, Astrophysics
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 2 Hot-swap 2.5″ SAS/SATA/NVMe drive bays, 2 Internal 2.5″ drive bays
• 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E x16 (LP), and 1 PCI-E 3.0 x8 (LP) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
• 9x 4cm heavy duty counter-rotating fans with air shroud
• 2000W Redundant Titanium Level (96%) Power Supplies

Thunderbolt 3.0 Support Up to 3 GPU 7.1 HD Audio

SYS-7039A-i

• CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4x 3.5″ drive bays supported by 90° rotating hard drive cage
• Optional 4x 2.5″ internal drive bays (supports 2 NVMe via opt. cables)
• 2x 5.25″ Peripheral drive bays
• 4 PCI-E 3.0 x16, 2 PCI-E x8 (1 PCH for Thunderbolt 3.0 AOC)
• 2x 1GbE, 1 Shared IPMI port
• 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio
• 1 rear 12cm exhaust fan, 1 front 12cm cooling fan
• 1200W Platinum Level Power Supply

Thunderbolt 3.0 Support Up to 3 GPU 7.1 HD Audio

SYS-7049A-T

• 4U Workstation for Virtualization and Multi-Tasking
• CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ drive bays (SATA3 by default, SAS3 via opt. AOC, 2 NVMe support with optional cables)
• 4 PCI-E 3.0 x16, 2 PCI-E x8 (1 PCH for Thunderbolt 3.0 AOC)
• 2x 1GbE, 1 Shared IPMI port • 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio • 2 Super quiet PWM fans and 1 Super quiet rear fan
• 1200W Platinum Level Power Supply

Up to 4 GPU/Coprocessor 7.1 HD Audio

SYS-7049GP-TRT

• GPU Server, Mission-critical app., enterprise server, large database, e-business, on-line transaction processing, oil & gas, medical app.
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5″ drive bays (2 SATA3 ports by default)
• 6 PCI-E 3.0 x16 and 1 PCI-E 3.0 x4 (in x8) slots
• 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
• 1 VGA, 2 COM, 4 USB 3.0 (rear), 2 USB 2.0 (front)
• 4 heavy duty fans, 4 exhaust fans, 2 active heat sink with optimal fan speed control
• 2200W Redundant Titanium Level (96%) Power Supplies

24 Hot-swap 2.5″ SAS3/SATA3

SSG-2029P-ACR24H / SSG-2029P-ACR24L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24 Hot-swap 2.5″ SAS3/SATA3 drive bays, 2 opt. onboard NVMe M.2
• Storage Options: SSG-2029P-ACR24H — SAS3 via Broadcom 3108 AOC SSG-2029P-ACR24L — SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

24 Hot-swap 2.5″ SAS3/SATA3 Dual JBOD Exp. Ports

SSG-2029P-E1CR24H / SSG-2029P-E1CR24L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24 Hot-swap 2.5″ SAS3/SATA3 drive bays
• Storage Options: SSG-2029P-E1CR24H — SAS3 via Broadcom 3108 AOC SSG-2029P-E1CR24L — SAS3 via Broadcom 3008 AOC
•16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

12 Hot-swap 3.5″ SAS3/SATA3 SAS3 via Broadcom 3108

SSG-6029P-E1CR12T

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 12 Hot-swap 3.5″ SAS3 (via Broadcom 3108)/SATA3 drive bays 2 Optional onboard NVMe M.2
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

12 Hot-swap 3.5″ SAS3/SATA3 Dual JBOD Exp. Ports

SSG-6029P-E1CR12H / 6029P-E1CR12L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 12 Hot-swap 3.5″ SAS3/SATA3 drive bays, 2 opt. onboard NVMe M.2
• Storage Options: SSG-6029P-E1CR12H — SAS3 via Broadcom 3108 AOC SSG-6029P-E1CR12L — SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

16 Hot-swap 3.5″ SAS3/SATA3 SAS3 via Broadcom 3108

SSG-6029P-E1CR16T

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 16 Hot-swap 3.5″ SAS3 (via Broadcom 3108)/SATA3 drive bays;
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1600W Redundant Titanium Level (96%) Power Supplies

16 Hot-swap 3.5″ SAS3/SATA3 Dual JBOD Exp. Ports

SSG-6039P-E1CR16H / SSG-6039P-E1CR16L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 16 Hot-swap 3.5″ SAS3/SATA3 drive bays, 2 opt. onboard NVMe M.2
• Storage Options: SSG-6039P-E1CR16H — SAS3 via Broadcom 3108 AOC SSG-6039P-E1CR16L — SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1600W Redundant Titanium Level (96%) Power Supplies

24 Hot-swap 3.5″ SAS3/SATA3 Dual JBOD Exp. Ports

SSG-6049P-E1CR24H / SSG-6049P-E1CR24L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 24″ Hot-swap 3.5 SAS3/SATA3 drive bays, 2 opt. onboard NVMe M.2
• Storage Options: SSG-6049P-E1CR24H — SAS3 via Broadcom 3108 AOC SSG-6049P-E1CR24L — SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

36 Hot-swap 3.5″ SAS3/SATA3 Dual JBOD Exp. Ports

SSG-6049P-E1CR36H / 6049P-E1CR36L

• Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
• Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 36 Hot-swap 3.5″ SAS3/SATA3 drive bays, 2 opt. onboard NVMe M.2
• Storage Options: SSG-6049P-E1CR36H — SAS3 via Broadcom 3108 AOC SSG-6049P-E1CR36L — SAS3 via Broadcom 3008 AOC
• 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
• 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
• 3 Hot-swap 8cm redundant PWM cooling fans
• 1200W Redundant Titanium Level (96%) Power Supplies

2U Ultra 4-Way 112 Cores per System 48 DDR4 DIMMs

SYS-2049U-TR4

• High End Enterprise Server, in-memory database, Business Intelligence, High Performance Computer Cluster, Virtualization, ERP, CRM
• Quad Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
• 11 PCI-E 3.0 total: 5 PCI-E 3.0 x8 and 6 PCI-E 3.0 x16 slots
• 48 DIMMs, up to 6TB ECC 3DS LRDIMMs, up to DDR4-2666MHz
• 24 Hot-swap 2.5″ drive bays: 4 U.2 NVMe + 20 SAS3 opt. via AOC
• 4 GbE via AOC, 1 dedicated IPMI
• 1 VGA, 1 COM, 2 USB 3.0 (rear)
• 4 heavy duty 8cm PWM fans
• 1600W (1+1) Redundant Titanium Level (96%) Power Supplies

7U 8-Way 224 Cores per System 96 DDR4 DIMMs

SYS-7089P-TR4T

• In-Memory Database Application, Research lab/National Lab, Scale-up HPC, Virtualization, ERP, CRM
• Octa Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• Up to 23 or 39 (OEM) PCI-E 3.0 slots, 32 U.2 NVMe support opt. available
• 96 DIMMs, up to 12TB ECC 3DS LRDIMMs, up to DDR4-2666MHz
• 16 Hot-swap 2.5″ SAS3 drive bays (w/ RAID cards); 8x 2.5″ or 6x 3.5″ internal drive bays (w/ RAID cards)
• 4 10GBase-T via SIOM, 1 dedicated IPMI
• 1 VGA, 1 COM, 2 USB 3.0 (rear)
• 8x 9cm 10.5K-10.8K RPM Hot-Swap Counter-rotating Rear Fans
• 5x 1600W (N+2) Redundant Titanium Level (96%) Power Supplies